| 2025/0011,940 | ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING ROUGHENED COPPER FOIL | Nov 15, 22 | Jan 09, 25 | Mitsubishi Gas Chemical Company Inc. |
| 2024/0240,036 | SOLID-INFUSED SURFACES, ARTICLES INCORPORATING SOLID-INFUSED SURFACES, METHODS OF MAKING, AND METHODS OF USE THEREOF | May 07, 22 | Jul 18, 24 | Not available |
| 2024/0183,052 | A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT CURRENT DENSITIES | Mar 25, 22 | Jun 06, 24 | Atotech Deutschland GmbH & Co. KG |
| 2024/0074,064 | METHOD FOR STRUCTURING METAL-CERAMIC SUBSTRATES, AND STRUCTURED METAL CERAMIC SUBSTRATE | Nov 05, 21 | Feb 29, 24 | Not available |
| 2023/0407,486 | ETCHING AGENT AND METHOD FOR PRODUCING CIRCUIT BOARD | Sep 30, 21 | Dec 21, 23 | Mec Company Ltd. |
| 2023/0140,900 | Methods For Wet Atomic Layer Etching Of Copper | Apr 20, 22 | May 11, 23 | Not available |
| 2023/0012,465 | METHODS OF SUPPORTING A GRAPHENE SHEET DISPOSED ON A FRAME SUPPORT | Aug 06, 20 | Jan 12, 23 | The Regents of the University of California |
| 2022/0389,592 | COPPER ETCHING SOLUTION | Apr 22, 22 | Dec 08, 22 | Not available |
| 2022/0349,064 | ETCHANT AND ETCHING METHOD FOR COPPER-MOLYBDENUM FILM LAYER | Dec 29, 20 | Nov 03, 22 | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
| 2022/0127,728 | ETCHING CHELATING AGENT, MANUFACTURING METHOD THEREOF, AND ETCHING SOLUTION COMPOSITION | May 07, 20 | Apr 28, 22 | Not available |
| 2021/0381,113 | ETCHANT FOR SELECTIVELY ETCHING COPPER AND COPPER ALLOY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE USING SAID ETCHANT | Nov 19, 19 | Dec 09, 21 | Mitsubishi Gas Chemical Company, Inc. |
| 2021/0178,461 | ARTICLE SUPERIOR IN DESIGN AND METHOD FOR PRODUCING THE SAME | Nov 16, 20 | Jun 17, 21 | NGK INSULATORS, LTD. |
| 2021/0047,740 | METHODS OF SUPPORTING A GRAPHENE SHEET DISPOSED ON A FRAME SUPPORT | Aug 06, 20 | Feb 18, 21 | The Regents of the University of California |
| 2020/0396,842 | METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE | Jun 26, 20 | Dec 17, 20 | Kateeva, Inc. |
| 2020/0263,308 | MICROETCHING AGENT FOR COPPER, COPPER SURFACE ROUGHENING METHOD AND WIRING BOARD PRODUCTION METHOD | Aug 20, 18 | Aug 20, 20 | Mec Company Ltd. |
| 2020/0141,010 | MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD | Jan 07, 20 | May 07, 20 | Mec Company Ltd. |
| 2019/0323,129 | ETCHING SOLUTION COMPOSITION | May 09, 18 | Oct 24, 19 | Not available |
| 2019/0255,317 | PRODUCTION METHOD FOR A RING ELECTRODE | Feb 18, 19 | Aug 22, 19 | Heraeus Deutschland GmbH & Co. KG |
| 2019/0003,062 | MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD | Feb 08, 17 | Jan 03, 19 | Mec Company Ltd. |
| 2019/0003,061 | ETCHING SOLUTION FOR COPPER AND COPPER ALLOY SURFACES | Dec 14, 16 | Jan 03, 19 | Atotech Deutschland GmbH |