C23F 1/34

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
2024/0376,606 ETCHING COMPOSITIONSJul 22, 24Nov 14, 24Texas Instruments Incorporated
2023/0243,041 ETCHING COMPOSITIONSJan 28, 22Aug 03, 23Not available
2023/0220,558 AN AQUEOUS BASIC ETCHING COMPOSITION FOR THE TREATMENT OF SURFACES OF METAL SUBSTRATESJun 10, 21Jul 13, 23Not available
2022/0117,092 CONTINUOUS ETCHING SYSTEMJul 29, 19Apr 14, 22Not available
2021/0332,484 HIGH-EFFICIENCY AND ENVIRONMENTAL FRIENDLY ALKALINE COPPER CHLORIDE ETCHANT FOR PRINTED CIRCUIT BOARDAug 04, 17Oct 28, 21Not available
2017/0037,519 METHOD OF IMPROVING LIFETIME OF ETCHING LIQUID AND YIELD IN CU-INTERCONNECTION PROCESS AND CU-INTERCONNECTION ETCHING DEVICEOct 19, 16Feb 09, 17SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
2014/0335,411 ETCHED SILICON STRUCTURES, METHOD OF FORMING ETCHED SILICON STRUCTURES AND USES THEREOFDec 21, 12Nov 13, 14NEXEON LIMITED, NEXEOL LIMITED,
2013/0207,030 WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICONDUCTOR PROCESSINGDec 21, 12Aug 15, 13Not available
2013/0029,489 POLISHING SLURRY, POLISHING METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICEOct 01, 12Jan 31, 13ASAHI GLASS COMPANY, LIMITED
2011/0287,223 METALLIC ARTICLES WITH HYDROPHOBIC SURFACESMay 24, 10Nov 24, 11Integran Technologies, Inc.
2009/0215,156 Method for Fabricating Nanogap and Nanogap SensorSep 05, 06Aug 27, 09Micobiomed. Co., Ltd.