2025/0118,490 | MULTILAYER ELECTRONIC COMPONENT | Jul 15, 24 | Apr 10, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
2025/0118,491 | MULTILAYER ELECTRONIC COMPONENT | Jul 23, 24 | Apr 10, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
2025/0087,420 | CAPACITOR ASSEMBLY PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE | Mar 20, 24 | Mar 13, 25 | Not available |
2025/0029,785 | Multilayer Capacitor and Circuit Board Containing the Same | Oct 07, 24 | Jan 23, 25 | Not available |
2025/0031,389 | CAPACITOR DEVICE AND MANUFACTURING METHOD THEREOF | Nov 13, 23 | Jan 23, 25 | Fujian Jinhua Integrated Circuit Co., Ltd. |
2025/0022,660 | MULTILAYER CERAMIC CAPACITOR | Oct 02, 24 | Jan 16, 25 | Not available |
2025/0014,821 | MULTILAYER CERAMIC CAPACITOR | Jun 27, 24 | Jan 09, 25 | Not available |
2025/0014,833 | ELECTRONIC COMPONENT | Sep 17, 24 | Jan 09, 25 | Not available |
2024/0429,270 | METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR) | Jun 23, 23 | Dec 26, 24 | Not available |
2024/0420,888 | MUTILAYER CERAMIC CAPACITOR | Aug 06, 24 | Dec 19, 24 | Not available |
2024/0404,750 | MULTILAYER CERAMIC CAPACITOR | Aug 12, 24 | Dec 05, 24 | Not available |
2024/0404,756 | MULTILAYER CERAMIC CAPACITOR | Aug 12, 24 | Dec 05, 24 | Not available |
2024/0395,458 | CAPACITOR AND METHOD OF MANUFACTURING CAPACITOR | Mar 13, 24 | Nov 28, 24 | KABUSHIKI KAISHA TOSHIBA |
2024/0355,542 | CAPACITOR HAVING ELECTRODE STRUCTURE OF HIGH VOLTAGE RESISTANCE FOR ELECTRIC VEHICLES | Mar 26, 24 | Oct 24, 24 | Not available |
2024/0312,707 | Composite Hydrophilic Membrane Electrode, Membrane Capacitor Cell, Preparation Method and use Thereof | Jul 02, 23 | Sep 19, 24 | Beijing University of Chemical Technology |
2024/0302,309 | SENSOR AND CAPACITOR DEVICE | Jul 11, 23 | Sep 12, 24 | KABUSHIKI KAISHA TOSHIBA |
2024/0302,310 | SENSOR AND CAPACITOR DEVICE | Jul 13, 23 | Sep 12, 24 | KABUSHIKI KAISHA TOSHIBA |
2024/0304,383 | MULTILAYER CERAMIC CAPACITOR | Jan 22, 24 | Sep 12, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
2024/0304,384 | ELECTRONIC COMPONENT | Dec 06, 23 | Sep 12, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
2024/0290,544 | A STRUCTURE AND METHODS OF FORMING THE STRUCTURE | Apr 05, 24 | Aug 29, 24 | Not available |