H05K

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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
2025/0114,071 ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAMEJan 03, 24Apr 10, 25SAMSUNG MEDISON CO., LTD.
2025/0114,621 Self-Centering Ceramic Washer That Prevents Misalignment When Positioned Between A Feedthrough And An EMI Filter Capacitor Or A Circuit Board Supporting EMI Filter Capacitors For A Medical DeviceApr 11, 24Apr 10, 25Not available
2025/0114,622 SELF-CENTERING CERAMIC WASHERDec 10, 24Apr 10, 25Greatbatch Ltd.
2025/0115,067 FIXING APPARATUS OF IMAGE FORMING APPARATUS AND IMAGE FORMING APPARATUSSep 30, 24Apr 10, 25Not available
2025/0116,509 Flex Assemblies for Electronically Coupling Sensors of a Front-Facing Outer Cover of a Head-wearable Device to a Logic Board Thereof, and Methods of Manufacturing ThereforJul 15, 24Apr 10, 25Not available
2025/0116,696 MULTIPLE CIRCUIT BOARD TESTERDec 16, 24Apr 10, 25LAT Enterprises, Inc., d/b/a MediPak Energy Systems
2025/0116,930 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDJan 18, 23Apr 10, 25Not available
2025/0116,970 PORTABLE ELECTRONIC ITEM INCLUDING A SECURITY DEVICE FOR SECURING A COVER OF A REMOVABLE ELECTRICAL POWER SOURCESep 17, 24Apr 10, 25ETA SA Manufacture Horlogère Suisse
2025/0116,979 DRIVING METHOD, APPARATUS, AND SLIDING-ROLLABLE DISPLAY DEVICEMar 29, 23Apr 10, 25CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE Technology Group Co. Ltd.;
2025/0117,066 CIRCUIT BOARD AND SWITCH SWITCHING METHOD THEREOFAug 09, 24Apr 10, 25ACER INCORPORATED
2025/0118,178 WATERPROOF DISTRESS ALARM DEVICEJan 03, 24Apr 10, 25Shenzhen Anice Technology Co., Ltd.
2025/0118,464 CHIP RESISTOROct 31, 22Apr 10, 25KOA Corporation
2025/0118,471 FERRITE PARTICLE POWDER FOR ELECTROMAGNETIC WAVE ABSORPTION, METHOD FOR MANUFACTURING SAME, AND RESIN COMPOSITION USING SAID FERRITE PARTICLE POWDER FOR ELECTROMAGNETIC WAVE ABSORPTIONFeb 07, 23Apr 10, 25Not available
2025/0118,498 MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARDDec 16, 24Apr 10, 25Taiyo Yuden Co. Ltd.
2025/0118,622 DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERINGDec 16, 24Apr 10, 25SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
2025/0118,641 PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTSDec 19, 24Apr 10, 25Intel Corp.
2025/0118,681 SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICEOct 03, 24Apr 10, 25Not available
2025/0118,704 APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDINGNov 06, 24Apr 10, 25Not available
2025/0118,705 PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIASDec 17, 24Apr 10, 25Not available
2025/0118,831 Swappable Battery Modules Comprising Immersion-Thermally Controlled Prismatic Battery Cells and Methods of Fabricating ThereofDec 17, 24Apr 10, 25Not available

Showing 1 to 20 of 97916 results