2025/0114,071 | ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME | Jan 03, 24 | Apr 10, 25 | SAMSUNG MEDISON CO., LTD. |
2025/0114,621 | Self-Centering Ceramic Washer That Prevents Misalignment When Positioned Between A Feedthrough And An EMI Filter Capacitor Or A Circuit Board Supporting EMI Filter Capacitors For A Medical Device | Apr 11, 24 | Apr 10, 25 | Not available |
2025/0114,622 | SELF-CENTERING CERAMIC WASHER | Dec 10, 24 | Apr 10, 25 | Greatbatch Ltd. |
2025/0115,067 | FIXING APPARATUS OF IMAGE FORMING APPARATUS AND IMAGE FORMING APPARATUS | Sep 30, 24 | Apr 10, 25 | Not available |
2025/0116,509 | Flex Assemblies for Electronically Coupling Sensors of a Front-Facing Outer Cover of a Head-wearable Device to a Logic Board Thereof, and Methods of Manufacturing Therefor | Jul 15, 24 | Apr 10, 25 | Not available |
2025/0116,696 | MULTIPLE CIRCUIT BOARD TESTER | Dec 16, 24 | Apr 10, 25 | LAT Enterprises, Inc., d/b/a MediPak Energy Systems |
2025/0116,930 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD | Jan 18, 23 | Apr 10, 25 | Not available |
2025/0116,970 | PORTABLE ELECTRONIC ITEM INCLUDING A SECURITY DEVICE FOR SECURING A COVER OF A REMOVABLE ELECTRICAL POWER SOURCE | Sep 17, 24 | Apr 10, 25 | ETA SA Manufacture Horlogère Suisse |
2025/0116,979 | DRIVING METHOD, APPARATUS, AND SLIDING-ROLLABLE DISPLAY DEVICE | Mar 29, 23 | Apr 10, 25 | CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE Technology Group Co. Ltd.; |
2025/0117,066 | CIRCUIT BOARD AND SWITCH SWITCHING METHOD THEREOF | Aug 09, 24 | Apr 10, 25 | ACER INCORPORATED |
2025/0118,178 | WATERPROOF DISTRESS ALARM DEVICE | Jan 03, 24 | Apr 10, 25 | Shenzhen Anice Technology Co., Ltd. |
2025/0118,464 | CHIP RESISTOR | Oct 31, 22 | Apr 10, 25 | KOA Corporation |
2025/0118,471 | FERRITE PARTICLE POWDER FOR ELECTROMAGNETIC WAVE ABSORPTION, METHOD FOR MANUFACTURING SAME, AND RESIN COMPOSITION USING SAID FERRITE PARTICLE POWDER FOR ELECTROMAGNETIC WAVE ABSORPTION | Feb 07, 23 | Apr 10, 25 | Not available |
2025/0118,498 | MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD | Dec 16, 24 | Apr 10, 25 | Taiyo Yuden Co. Ltd. |
2025/0118,622 | DIRECT BONDED COPPER SUBSTRATES FABRICATED USING SILVER SINTERING | Dec 16, 24 | Apr 10, 25 | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
2025/0118,641 | PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS | Dec 19, 24 | Apr 10, 25 | Intel Corp. |
2025/0118,681 | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE | Oct 03, 24 | Apr 10, 25 | Not available |
2025/0118,704 | APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING | Nov 06, 24 | Apr 10, 25 | Not available |
2025/0118,705 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS | Dec 17, 24 | Apr 10, 25 | Not available |
2025/0118,831 | Swappable Battery Modules Comprising Immersion-Thermally Controlled Prismatic Battery Cells and Methods of Fabricating Thereof | Dec 17, 24 | Apr 10, 25 | Not available |