| 2025/0115,751 | THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LAMINATES BASED ON SAME | Oct 03, 24 | Apr 10, 25 | Not available |
| 2025/0120,016 | WIRING BOARD | Dec 22, 22 | Apr 10, 25 | KYOCERA CORPORATION |
| 2025/0108,924 | MODULAR FLEXIBLE SMART MULTI ELECTRODE AIR IONIZER | Nov 29, 23 | Apr 03, 25 | B/E Aerospace, Inc. |
| 2025/0109,057 | GLASS COMPOSITION, GLASS FIBER INCLUDING THE SAME, AND ELECTRONIC PRODUCT INCLUDING THE GLASS FIBER | Apr 26, 24 | Apr 03, 25 | Not available |
| 2025/0109,279 | COMPOSITE MATERIAL, APPLICATIONS THEREOF, AND METHOD FOR PRODUCING COMPOSITE MATERIAL | Dec 11, 24 | Apr 03, 25 | Not available |
| 2025/0110,529 | FOLDABLE COVER AND DISPLAY FOR AN ELECTRONIC DEVICE | Dec 12, 24 | Apr 03, 25 | Not available |
| 2025/0112,144 | INTEGRATED CIRCUIT PACKAGES INCLUDING A SUBSTRATE HAVING THERMAL ISOMERIC MOIETIES AND NON-THERMAL ISOMERIC MOIETIES | Sep 28, 23 | Apr 03, 25 | Intel Corp. |
| 2025/0112,588 | FOLDABLE PHOTOVOLTAIC SOLAR PANEL ASSEMBLY FOR GENERATING AND SUPPLYING ELECTRIC ENERGY TO AN ORBITING SATELLITE | Dec 13, 23 | Apr 03, 25 | Not available |
| 2025/0109,530 | GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD | Jun 01, 23 | Apr 03, 25 | Not available |
| 2025/0113,434 | THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDUCTION | Sep 28, 23 | Apr 03, 25 | Not available |
| 2025/0113,439 | CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SPLIT SUBSTRATE | Nov 25, 24 | Apr 03, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0113,445 | SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL PROPERTIES OF A METAL MATERIAL UTILIZED IN A DEFORMABLE CIRCUIT | Oct 02, 23 | Apr 03, 25 | Not available |
| 2025/0101,182 | POLY(ESTER-IMIDE) POLYMERS AND USES THEREOF | Jan 06, 23 | Mar 27, 25 | SOLVAY SPECIALTY POLYMERS USA, LLC |
| 2025/0101,217 | RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING SAME | Oct 19, 23 | Mar 27, 25 | LG Chem Ltd. |
| 2025/0105,132 | POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES | Sep 26, 23 | Mar 27, 25 | Not available |
| 2025/0106,982 | NANOTWIN LINER FOR THROUGH GLASS VIAS | Sep 25, 23 | Mar 27, 25 | Not available |
| 2025/0106,983 | STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION | Sep 27, 23 | Mar 27, 25 | Not available |
| 2025/0106,997 | ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES | Sep 26, 23 | Mar 27, 25 | Not available |
| 2025/0098,065 | BONDED BODY AND CERAMIC CIRCUIT BOARD USING SAME | Dec 04, 24 | Mar 20, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0098,074 | MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD | Sep 19, 23 | Mar 20, 25 | Not available |