| 2025/0120,008 | PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION | Dec 22, 23 | Apr 10, 25 | PANJIT INTERNATIONAL INC. |
| 2025/0112,142 | ARRANGEMENT FOR A SEMICONDUCTOR ARRANGEMENT COMPRISING AT LEAST ONE PASSIVE COMPONENT AND A SUBSTRATE | Nov 28, 22 | Apr 03, 25 | Siemens Aktiengesellschaft |
| 2025/0106,993 | CIRCUIT CARRIER AND METHOD | Sep 19, 24 | Mar 27, 25 | Vitesco Technologies GmbH |
| 2025/0089,162 | SUBSTRATE STRUCTURE | Oct 19, 23 | Mar 13, 25 | SUBTRON TECHNOLOGY CO. LTD. |
| 2025/0075,062 | RESIN COMPOSITION, RESIN-ATTACHED METAL FOIL, CURED PRODUCT, METAL-BASED SUBSTRATE, AND ELECTRONIC PART | Jan 25, 22 | Mar 06, 25 | TAIYO Holdings Co., Ltd. |
| 2025/0081,340 | PRINTED CIRCUIT BOARD | Feb 07, 24 | Mar 06, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2025/0026,951 | EPOXY RESIN COMPOSITION FOR INTERLAYER INSULATION, RESIN SHEET FOR INTERLAYER INSULATION, LAMINATE FOR CIRCUIT BOARD, METAL- BASED CIRCUIT BOARD, AND POWER MODULE | Sep 16, 24 | Jan 23, 25 | NHK SPRING CO., LTD. |
| 2025/0008,645 | PRINTED WIRING BOARD | Jun 25, 24 | Jan 02, 25 | Ibiden Co. Ltd. |
| 2024/0414,841 | COPPER/CERAMIC JOINED BODY AND INSULATED CIRCUIT BOARD | Dec 02, 22 | Dec 12, 24 | Mitsubishi Materials Corporation |
| 2024/0357,732 | Isolation Slots for an Antenna and Printed Circuit Board Interface | Apr 24, 23 | Oct 24, 24 | Not available |
| 2024/0349,424 | METHOD AND SYSTEM FOR PROVIDING ILLUMINATING OBJECTS WITHIN SUBSTRATE | Feb 09, 24 | Oct 17, 24 | Not available |
| 2024/0324,116 | STORAGE | Nov 01, 23 | Sep 26, 24 | Not available |
| 2024/0306,292 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Nov 09, 23 | Sep 12, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0290,708 | SUBSTRATE-ON-FOIL WITH METAL PATTERNED COMPONENTS FORMED THEREIN AND METHOD OF MAKING THE SAME | Feb 28, 24 | Aug 29, 24 | LUX SEMICONDUCTORS, INC. |
| 2024/0292,532 | COMPONENT MOUNTING BOARD | Oct 05, 22 | Aug 29, 24 | Nippon Mektron Ltd. |
| 2024/0284,599 | Method for preparing novel material layer structure of circuit board and article thereof | Mar 26, 24 | Aug 22, 24 | Not available |
| 2024/0284,608 | CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE | Mar 21, 24 | Aug 22, 24 | Not available |
| 2024/0268,021 | PRINTED WIRING BOARD | Feb 07, 24 | Aug 08, 24 | Ibiden Co. Ltd. |
| 2024/0268,022 | HEAT-DISSIPATING CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND PRODUCTION METHOD FOR HEAT-DISSIPATING CIRCUIT BOARD | Aug 23, 22 | Aug 08, 24 | NOF Corporation |
| 2024/0260,179 | PRINTED WIRING BOARD | Jan 30, 24 | Aug 01, 24 | Ibiden Co. Ltd. |