| 2025/0100,268 | METHOD OF DISPENSING PASTE FOR A PRINTER USING A PASTE DISPENSING APPARATUS AND PASTE DISPENSING APPARATUS FOR DISPENSING PASTE FOR A PRINTER | Mar 08, 22 | Mar 27, 25 | Not available |
| 2025/0105,132 | POROUS COPPER LINER FOR THROUGH GLASS VIA (TGV) GLASS CORES | Sep 26, 23 | Mar 27, 25 | Not available |
| 2025/0096,430 | RECHARGEABLE BATTERY MODULE | Aug 07, 24 | Mar 20, 25 | Samsung SDI Co., Ltd. |
| 2025/0098,059 | CIRCUIT BOARD | Dec 04, 24 | Mar 20, 25 | Not available |
| 2025/0089,161 | ULTRA-THIN LAMINATED GLASS ASSEMBLY WITH ELECTRIC CIRCUITRY | Nov 25, 24 | Mar 13, 25 | Not available |
| 2025/0089,166 | HYBRID PRINTED CIRCUIT BOARD | Jul 16, 24 | Mar 13, 25 | Not available |
| 2025/0081,341 | Method and Apparatus of Conductive Hybrid Material Layer Stacks with Magnetic Material | Oct 30, 24 | Mar 06, 25 | Not available |
| 2025/0071,893 | CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF | Dec 15, 22 | Feb 27, 25 | AMOSENSE CO., LTD. |
| 2025/0071,894 | PRINTED WIRING BOARD SUBSTRATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD | Mar 20, 23 | Feb 27, 25 | Sumitomo Electric Industries Ltd.; Sumitomo Electric Printed Circuits, Inc.; |
| 2025/0059,665 | ELECTROLYTIC SOLUTION FOR COPPER FOIL, AND ELECTROLYTIC COPPER FOIL | Dec 20, 22 | Feb 20, 25 | Shenzhen Institute of Advanced Electronic Materials |
| 2025/0063,655 | MEMBRANE CIRCUIT BOARD | Sep 14, 23 | Feb 20, 25 | Not available |
| 2025/0063,656 | SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND SMART WEARABLE SYSTEM | Dec 23, 22 | Feb 20, 25 | MIDAS H&T INC. |
| 2025/0063,672 | REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICS | Aug 14, 23 | Feb 20, 25 | Not available |
| 2025/0056,722 | HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD | Aug 06, 24 | Feb 13, 25 | SHANGHAI METAPWR ELECTRONICS CO., LTD |
| 2025/0048,550 | TEXTILE CONDUCTIVE BUS AND METHOD OF MAKING THE SAME | Jul 30, 24 | Feb 06, 25 | The Charles Stark Draper Laboratory, Inc. |
| 2025/0036,176 | Printed Circuits with Embedded Resistive Thermal Devices | Oct 01, 24 | Jan 30, 25 | Not available |
| 2025/0040,036 | CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT THERMAL EXPANSION COEFFICIENTS AND METHOD FOR PRODUCING THE SAME | Oct 31, 23 | Jan 30, 25 | Not available |
| 2025/0040,041 | ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING SAME | Oct 16, 24 | Jan 30, 25 | Not available |
| 2025/0040,044 | ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN | Dec 07, 23 | Jan 30, 25 | Not available |
| 2025/0040,054 | TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN | Dec 07, 23 | Jan 30, 25 | Not available |