| 2025/0120,008 | PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION | Dec 22, 23 | Apr 10, 25 | PANJIT INTERNATIONAL INC. |
| 2025/0108,597 | PRINTING SYSTEM AND METHOD FOR CONTROLLING PRINTING SYSTEM | Sep 25, 24 | Apr 03, 25 | Not available |
| 2025/0113,439 | CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SPLIT SUBSTRATE | Nov 25, 24 | Apr 03, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0113,446 | PLATED THROUGH-HOLE STRUCTURES AND METHOD FOR THE MANUFACTURE THEREOF | Sep 30, 24 | Apr 03, 25 | Not available |
| 2025/0106,979 | Embeddable Electrically Insulating Thermal Connector and Circuit Board Including the Same | Dec 09, 24 | Mar 27, 25 | Not available |
| 2025/0106,987 | FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRUCTURE | Sep 26, 23 | Mar 27, 25 | Cyntec Co. Ltd. |
| 2025/0107,006 | RF COVER LAYER | Sep 21, 23 | Mar 27, 25 | Raytheon Company |
| 2025/0107,007 | FOLD FLEX CIRCUIT FOR LNOP | Dec 10, 24 | Mar 27, 25 | Not available |
| 2025/0097,644 | MEMBRANE UNIT FOR SPEAKER DEVICE | Jul 22, 24 | Mar 20, 25 | Not available |
| 2025/0098,062 | TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED TAMPER-DETECT CIRCUITRY | Sep 19, 23 | Mar 20, 25 | Not available |
| 2025/0098,074 | MITIGATING FIBER WEAVE EFFECT IN A PRINTED CIRCUIT BOARD | Sep 19, 23 | Mar 20, 25 | Not available |
| 2025/0082,220 | CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS | Nov 25, 24 | Mar 13, 25 | Not available |
| 2025/0085,332 | SYSTEM AND METHOD FOR DETECTING DEFECTIVE BACK-DRILLS IN PRINTED CIRCUIT BOARDS | Nov 25, 24 | Mar 13, 25 | Not available |
| 2025/0089,154 | DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES FOR SHIELDING APPLICATIONS | Jul 31, 24 | Mar 13, 25 | Not available |
| 2025/0089,167 | WIRING SUBSTRATE | Sep 11, 24 | Mar 13, 25 | Ibiden Co. Ltd. |
| 2025/0089,171 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | May 23, 24 | Mar 13, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2025/0089,174 | GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORS | Sep 08, 23 | Mar 13, 25 | Not available |
| 2025/0089,175 | Method for Manufacturing Multicoloured Printed Circuits for Smart Card Modules | Jul 11, 22 | Mar 13, 25 | Not available |
| 2025/0080,074 | FILTER PRODUCTION METHOD AND FILTER | Oct 26, 21 | Mar 06, 25 | Not available |
| 2025/0081,329 | WIRING BOARD AND LAMINATED WIRING BOARD | Aug 29, 24 | Mar 06, 25 | Not available |