| 2025/0089,174 | GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORS | Sep 08, 23 | Mar 13, 25 | Not available |
| 2025/0071,909 | METHOD OF MANUFACTURING CIRCUIT BOARD | Aug 23, 24 | Feb 27, 25 | Not available |
| 2025/0063,654 | STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING THE SAME, AND METHOD OF MAKING THE SAME | Sep 13, 23 | Feb 20, 25 | Not available |
| 2025/0063,664 | CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS | Aug 14, 23 | Feb 20, 25 | Not available |
| 2025/0056,723 | ELECTRONIC DEVICE INCLUDING INTERPOSER | Oct 28, 24 | Feb 13, 25 | Not available |
| 2025/0037,905 | COMMUNICATION CABLE INCLUDING A MOSAIC TAPE | Oct 11, 24 | Jan 30, 25 | Panduit Corp. |
| 2024/0414,850 | CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | Jan 04, 24 | Dec 12, 24 | Unimicron Technology Corp. |
| 2024/0407,105 | X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS | May 31, 23 | Dec 05, 24 | Not available |
| 2024/0365,473 | METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CIRCUIT BOARD MADE THEREFROM | Jul 04, 24 | Oct 31, 24 | Not available |
| 2024/0349,422 | COPPER CLAD LAMINATE AND PRINTED WIRING BOARD | Mar 15, 22 | Oct 17, 24 | Not available |
| 2024/0329,525 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | Jun 13, 24 | Oct 03, 24 | Asahi Kasei Kabushiki Kaisha |
| 2024/0301,173 | THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD | May 15, 24 | Sep 12, 24 | Panasonic Intellectual Property Management Co., Ltd. |
| 2024/0292,527 | Flexible Interconnect Circuits And Methods Of Fabrication Thereof | May 06, 24 | Aug 29, 24 | CelLink Corporation |
| 2024/0292,544 | METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAFER LEVEL COMPONENT | Dec 05, 23 | Aug 29, 24 | Not available |
| 2024/0274,543 | Electronic device and manufacturing method thereof | Jan 08, 24 | Aug 15, 24 | Chimei Innolux Corporation |
| 2024/0276,636 | CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFACTURING PROCESS THEREOF | May 03, 23 | Aug 15, 24 | Not available |
| 2024/0268,027 | CIRCUIT BOARD | Jun 15, 22 | Aug 08, 24 | Not available |
| 2024/0260,177 | METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD | May 24, 21 | Aug 01, 24 | Nitto Denko Corporation |
| 2024/0260,182 | CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME | Apr 09, 24 | Aug 01, 24 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2024/0244,755 | Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad Laminate and Printed Circuit Board | May 30, 22 | Jul 18, 24 | Not available |