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| 2025/0063,664 | CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS | Aug 14, 23 | Feb 20, 25 | Not available |
| 2025/0048,559 | DRAPABLE, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR | Aug 08, 24 | Feb 06, 25 | Not available |
| 2025/0031,316 | METHODS FOR FORMING CIRCUIT PATTERN ON SUBSTRATE USING METAL FOIL WITH LOW SURFACE ROUGHNESS | Nov 23, 23 | Jan 23, 25 | Not available |
| 2024/0405,345 | WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVIDED WITH WIRING BOARD | Sep 29, 22 | Dec 05, 24 | Not available |
| 2024/0276,632 | Interconnect Circuit Methods And Devices | Apr 02, 24 | Aug 15, 24 | CelLink Corporation |
| 2024/0260,200 | METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATE | Jun 24, 22 | Aug 01, 24 | Not available |
| 2024/0206,052 | METHOD AND STRUCTURE FOR ALIGNMENT OF LENS TO OPTICAL PRODUCT AT PCBA LEVEL | Feb 29, 24 | Jun 20, 24 | PixArt Imaging Inc. |
| 2024/0206,075 | A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE WITH AT LEAST ONE PATTERNED LAYER | Apr 19, 22 | Jun 20, 24 | Not available |
| 2024/0206,076 | METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE | Feb 29, 24 | Jun 20, 24 | Not available |
| 2024/0188,224 | ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHODS OF MANUFACTURING THEREOF | Jan 02, 24 | Jun 06, 24 | Not available |
| 2024/0107,680 | SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERCONNECT | Sep 22, 22 | Mar 28, 24 | Not available |
| 2023/0380,072 | TAPE AND MANUFACTURING METHOD THEREOF | Feb 14, 23 | Nov 23, 23 | Not available |
| 2023/0276,578 | ELECTROPLATING EDGE CONNECTOR PINS OF PRINTED CIRCUIT BOARDS WITHOUT USING TIE BARS | May 08, 23 | Aug 31, 23 | Not available |
| 2023/0093,870 | Method for Forming Resistance on Circuit Board and Circuit Board Having Resistance | Nov 17, 21 | Mar 30, 23 | Not available |
| 2023/0007,781 | METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MANUFACTURING MOLDED OBJECT, MOLDED OBJECT | Nov 18, 20 | Jan 05, 23 | Fujikura Ltd. |
| 2022/0192,028 | MILLING OF FLEX FOIL WITH TWO CONDUCTIVE LAYERS FROM BOTH SIDES | Apr 03, 20 | Jun 16, 22 | Not available |
| 2021/0243,899 | A PCB STRUCTURE FOR EMBEDDING ELECTRONIC COMPONENTS | May 02, 19 | Aug 05, 21 | Not available |
| 2021/0161,018 | METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE | Jun 27, 19 | May 27, 21 | Not available |
| 2021/0092,844 | Double-Sided, Single Conductor Laminated Substrate | Mar 18, 20 | Mar 25, 21 | Not available |