| 2025/0120,010 | WIRING BOARD | Sep 30, 24 | Apr 10, 25 | Not available |
| 2025/0113,442 | COMPOSITE FILM, RIGID FLEXIBLE PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE INCLUDING SAME | Dec 13, 24 | Apr 03, 25 | Samsung Electronics Co. Ltd. |
| 2025/0106,992 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Aug 21, 24 | Mar 27, 25 | Not available |
| 2025/0107,001 | COIL DEVICE AND PRINTED WIRING BOARD | Dec 23, 22 | Mar 27, 25 | Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Industries Ltd.; |
| 2025/0069,900 | Methods And Systems Of Forming Metal Interconnect Layers Using Engineered Templates | Nov 11, 24 | Feb 27, 25 | Not available |
| 2025/0071,896 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD | Feb 27, 24 | Feb 27, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2025/0071,909 | METHOD OF MANUFACTURING CIRCUIT BOARD | Aug 23, 24 | Feb 27, 25 | Not available |
| 2025/0071,912 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | Jul 24, 24 | Feb 27, 25 | Not available |
| 2025/0063,664 | CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS | Aug 14, 23 | Feb 20, 25 | Not available |
| 2025/0048,556 | Metal-ceramic substrate and method for producing a metal ceramic substrate | Sep 30, 22 | Feb 06, 25 | Not available |
| 2025/0008,643 | INTEGRATED ELECTRODE AND CABLE STRUCTURE | Jun 27, 24 | Jan 02, 25 | Not available |
| 2024/0422,920 | Circuit board | Jul 04, 24 | Dec 19, 24 | Not available |
| 2024/0397,636 | METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTILAYER PCB FABRICATION PROCESS | May 22, 23 | Nov 28, 24 | NVIDIA Corporation; BAR - ILAN University; |
| 2024/0373,550 | WIRING BOARD, MANUFACTURING METHOD OF SAME, FILM, AND LAMINATE | Jul 22, 24 | Nov 07, 24 | FUJIFILM Corporation |
| 2024/0365,469 | METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD | Apr 22, 22 | Oct 31, 24 | FUJIKURA PRINTED CIRCUITS LTD. |
| 2024/0365,474 | SENSING DEVICE AND PREPARATION METHOD THEREFOR | Aug 10, 22 | Oct 31, 24 | Not available |
| 2024/0349,423 | METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD | May 30, 22 | Oct 17, 24 | Not available |
| 2024/0306,304 | APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE | Feb 14, 24 | Sep 12, 24 | Hyundai Mobis Co. Ltd. |
| 2024/0294,846 | RELEASE AGENT FOR CIRCUIT BOARD RESIN FILM AND PRODUCTION METHOD FOR CIRCUIT BOARD | Jun 10, 22 | Sep 05, 24 | NOF Corporation |
| 2024/0292,529 | CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD | Dec 28, 23 | Aug 29, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |