H05K 3/08

Technology



back to "H05K 3/08" profile

More Results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
2024/0057,260 CIRCUIT BOARD MANUFACTURING SYSTEM AND METHODFeb 15, 23Feb 15, 24Not available
2015/0334,826 EMBEDDED TRACESMay 19, 14Nov 19, 15Sierra Circuits, Inc.
2015/0189,763 Method for Embedding at Least One Component in a Printed Circuit BoardJun 25, 13Jul 02, 15AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
2015/0092,377 DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATIONSep 30, 13Apr 02, 15NXP USA, INC.
2014/0259,658 METHOD OF CUTTING CONDUCTIVE PATTERNSJun 24, 13Sep 18, 14TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
2012/0312,776 METHOD FOR MAKING TOUCH PANELDec 29, 11Dec 13, 12Shih Hua Technology Ltd.
2012/0098,791 TOUCH PANELS, METHOD FOR FABRICATING TOUCH PANELS, DISPLAY DEVICES, AND METHOD FOR FABRICATING DISPLAY DEVICESMar 03, 10Apr 26, 12SHARP KABUSHIKI KAISHA
2008/0063,576 Micro Plasma Jet GeneratorJul 22, 04Mar 13, 08JAPAN SCIENCE AND TECHNOLOGY AGENCY