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Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
RE47767 Group III-nitride layers with patterned surfacesDec 23, 15Dec 17, 19Nokia of America Corporation
9994440 MEMS device and processJun 30, 14Jun 12, 18Cirrus Logic, Inc.
9998812 Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signalsFeb 15, 16Jun 12, 18Infineon Technologies AG
9994439 Pressure sensor, manufacturing method of pressure sensor, altimeter, electronic apparatus, and moving objectJan 27, 17Jun 12, 18Seiko Epson Corporation
9994441 Optical electronic device and method of fabricationOct 31, 16Jun 12, 18Agilent Technologies Texas Instruments Incorporated
9988260 Rough MEMS surfaceApr 29, 16Jun 05, 18NXP USA, Inc.
9988261 Micromechanical device and method for manufacturing a micromechanical deviceJun 13, 13Jun 05, 18502 Robert Bosch GmbH
9988265 Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulationAug 22, 16Jun 05, 18Semiconductor Manufacturing International (Shanghai) Corporation
9991251 Semiconductor deviceJun 02, 17Jun 05, 18Murata Manufacturing Co., Ltd.
9983169 Integrated microfluidic circuit with electrowetting-based operation and corresponding microfluidic systemSep 17, 14May 29, 18SMI STMicroelectronics S.r.l
9983401 MEMS deviceMay 16, 16May 29, 18Intel Corp.
9981841 MEMS integrated pressure sensor and microphone devices and methods of forming sameMay 15, 17May 29, 18Taiwan Semiconductor Manufacturing Company, Ltd.
9981273 Negative dielectrophoresis for selective elution of immuno-bound particlesSep 30, 13May 29, 18The Board of Trustees of the Leland Stanford Junior University
9983403 Device and method for micro-electro-mechanical-system photonic switchOct 03, 14May 29, 18HUAWEI TECHNOLOGIES CO., LTD.
9981267 Paired laser and electrokinetic separation, manipulation, and analysis deviceJun 15, 16May 29, 18The Goverment of the United States of America as represented by the Secretary of the Navy
9986344 MEMS microphone with low pressure region between diaphragm and counter electrodeNov 06, 15May 29, 18Infineon Technologies AG
9975757 Wafer Level Hermetic Seal Process for microelectromechanical systems (MEMS) devicesJun 03, 15May 22, 18Taiwan Semiconductor Manufacturing Co Ltd.
9975762 Stacked semiconductor structure and method of forming the sameJun 12, 13May 22, 18Taiwan Semiconductor Manufacturing Company, Ltd.
9975758 Wafer processing equipment having exposable sensing layersJul 13, 17May 22, 18Applied Materials Inc.
9975760 MEMS sensor device package housing with an embedded controllable deviceJun 28, 16May 22, 18Robert Bosch GmbH

Showing 1 to 20 of 1550 results