H01L

Technology



back to "H01L" profile

More Results

Showing 1 to 20 of 317334 results

Patent/Pub #TitleFiling DateIssue/Publication DatePatent Owner
RE47923 Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumpsMar 01, 16Mar 31, 20STATS ChipPAC Pte. Ltd.
RE47909 Wafer transfer apparatus and substrate transfer apparatusMay 10, 18Mar 17, 20Kawasaki Jukogyo Kabushiki Kaisha
RE47892 Semiconductor light emitting deviceJan 10, 14Mar 03, 20Epistar Corporation
RE47890 Packaging for fingerprint sensors and methods of manufactureJul 11, 17Mar 03, 20Amkor Technology, Inc.
RE47891 Emission device, surface light source device, display and light flux control memberMay 23, 16Mar 03, 20Enplas Corporation
RE47866 Three-dimensionally stacked nonvolatile semiconductor memoryFeb 04, 16Feb 18, 20TOSHIBA MEMORY CORPORATION
RE47854 Semiconductor component and method for contacting said semiconductor componentDec 12, 13Feb 11, 20Infineon Technologies AG
RE47816 Three-dimensional nonvolatile memory cell structure with upper body connectionJan 12, 18Jan 14, 20Conversant Intellectual Property Management Inc.
RE47817 Display device with a narrow frameApr 30, 15Jan 14, 20EL TECHNOLOGY FUSION GODO KAISHA
RE47815 Nonvolatile semiconductor memory deviceApr 24, 18Jan 14, 20TOSHIBA MEMORY CORPORATION
RE47804 Luminescent display deviceSep 28, 18Jan 07, 20Joled, Inc.
RE47780 Light-emitting apparatus, backlight unit, liquid crystal display apparatus, and illumination apparatusJul 17, 17Dec 24, 19Panasonic Intellectual Property Management Co., Ltd.
RE47781 Organic electro luminescent display and method for fabricating the sameOct 04, 16Dec 24, 19Samsung Display Co., Ltd.
RE47767 Group III-nitride layers with patterned surfacesDec 23, 15Dec 17, 19Nokia of America Corporation
RE47765 Solid state imaging deviceAug 10, 17Dec 10, 19Nikon Corporation
RE47763 Organic electroluminescence device and electronic deviceApr 05, 17Dec 10, 19Idemitsu Kosan Co., Ltd.
RE47710 Power semiconductor having a lightly doped drift and buffer layerFeb 20, 15Nov 05, 19Infineon Technologies Austria AG
RE47709 Forming grounded through-silicon vias in a semiconductor substrateOct 27, 16Nov 05, 19Taiwan Semiconductor Manufacturing Company Ltd.
RE47708 Semiconductor deviceSep 14, 15Nov 05, 19NICHIA CORPORATION
RE47711 White light devices using non-polar or semipolar gallium containing materials and phosphorsOct 14, 15Nov 05, 19Soraa, Inc.

Showing 1 to 20 of 317334 results