1/00 | Etching metallic material by chemical means |
1/02 | Etching metallic material by chemical means Local etching |
1/04 | Etching metallic material by chemical means Local etching Chemical milling |
1/06 | Etching metallic material by chemical means Sharpening files |
1/08 | Etching metallic material by chemical means Apparatus, e.g. for photomechanical printing surfaces |
1/10 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) |
1/12 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Gaseous compositions |
1/14 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions |
1/16 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) |
1/18 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching copper or alloys thereof |
1/20 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching aluminium or alloys thereof |
1/22 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching magnesium or alloys thereof |
1/24 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching silicon or germanium |
1/26 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching refractory metals |
1/28 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching iron group metals |
1/30 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Acidic compositions (C23F 1/42 takes precedence) for etching other metallic material |
1/32 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Alkaline compositions (C23F 1/42 takes precedence) |
1/34 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Alkaline compositions (C23F 1/42 takes precedence) for etching copper or alloys thereof |
1/36 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Alkaline compositions (C23F 1/42 takes precedence) for etching aluminium or alloys thereof |
1/38 | Etching metallic material by chemical means Etching compositions (C23F 1/44 takes precedence) Aqueous compositions Alkaline compositions (C23F 1/42 takes precedence) for etching refractory metals |