Semiconductor chip assembly with bumped metal pillar
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 31, 2006
Grant Date -
N/A
app pub date -
Nov 22, 2004
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with the bumped terminal and extends laterally beyond the bumped terminal and the metal pillar, and the metal pillar contacts and extends vertically beyond the bumped terminal.
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