Chip housing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6160218
SERIAL NO

08894604

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A housing to accept at least one electronic component, e.g., a chip with a cover and an opposing cover. The cover and opposing cover are formed to surround the component. On the inner surface of the cover and the opposing cover, there are conductive paths arranged such that the paths on the cover connect terminal areas of the component to the paths on the opposing cover and the paths on the opposing cover open into external terminals of the housing. The cover and/or the opposing cover is/are flexible and are suitable to be interconnected with surrounding sub-housings.

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Patent Owner(s)

  • PAC TECH - PACKAGING TECHNOLOGIES GMBH

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Azdasht, Ghassem Berlin, DE 59 593
Reichl, Herbert Berlin, DE 9 68
Zakel, Elke Falkensee, DE 50 614

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