Forming electrical conductors in long microdiameter holes
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United States of America Patent
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-
Dec 9, 1986
Grant Date -
N/A
app pub date -
Sep 17, 1984
filing date -
Sep 17, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A conductor is provided through a narrow bore hole of a wafer. The hole has a length-to-diameter ratio in excess of six. The conductor is formed by condensation of metal vapor generated at the bottom of said hole by a spark. The spark is generated between a vaporizable metal at the bottom of the hole and a thin electrode disposed above the hole from a conventional automobile coil and battery operating through a mercury switch.
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