LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same
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United States of America Patent
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Mar 2, 2010
Grant Date -
Jul 24, 2008
app pub date -
Oct 25, 2007
filing date -
Jan 19, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.
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