Method for separating circuit dies from a wafer
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United States of America Patent
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Nov 8, 1994
Grant Date -
N/A
app pub date -
Jul 22, 1992
filing date -
Jul 22, 1992
priority date (Note) -
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Abstract
A method for separating individual dies from a wafer in which the wafer is adhered to a plastic film on a film carrier with the circuit side of the wafer facing the film and with circuit components exposed through a hole in the film. In this manner, the circuitry is protected from dust, and trauma from the sawing and cleaning processes because the circuitry is sealed between the film and the non-circuit side of the wafer.
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