Warpage compensating heat spreader
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United States of America Patent
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-
Sep 11, 2001
Grant Date -
N/A
app pub date -
Dec 2, 1999
filing date -
Dec 2, 1999
priority date (Note) -
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status (Latency Note)
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Abstract
A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.
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