Integrated circuits with at least one layer that has more than one preferred interconnect direction, and method for manufacturing such IC's
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United States of America Patent
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Apr 25, 2006
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N/A
app pub date -
Aug 26, 2002
filing date -
Jan 22, 2002
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Abstract
Some embodiments of the invention provide an integrated-circuit chip that has a design based on a wiring model that allows at least a particular wiring layer to have more than one preferred wiring directions. Other embodiments provide a method of manufacturing an integrated circuit ('IC') that has a plurality of wiring layers. The method specifies a layout of the IC by using a wiring model that specifies more than one preferred wiring direction for at least a region of a particular wiring layer. The method then uses the layout to fabricate the integrated circuit.
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