Substrate transfer apparatus, and method of transferring substrates
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United States of America Patent
Stats
-
Jul 8, 1997
Issued Date -
N/A
app pub date -
May 31, 1995
filing date -
Jun 5, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a vertical heat treatment apparatus, a transfer apparatus is used to transfer a wafer between a wafer carrier and a wafer boat. The transfer apparatus comprises a base unit, a fork, three non-contact type sensors, and a main controller. The base unit can move between a first position at which to transfer the wafer to and from the wafer carrier and a second position at which to transfer the wafer to and from the wafer boat. The fork can move back and forth with respect to the base unit, for supporting the wafer. The non-contact type sensors are mounted on the fork, for detecting the position of the wafer. The main controller controls the base unit and the fork in accordance with the data detected by the non-contact type sensors.
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