Method of sawing crystalline rods, and multiple-blade internal-hole saw for carrying out the method
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United States of America Patent
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-
Apr 30, 1985
Grant Date -
N/A
app pub date -
Apr 21, 1983
filing date -
Apr 30, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Crystalline rods or blocks can be sawed into thin wafers by sawing the rodr block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed. The method makes possible the use of multiple-blade internal-hole saws, and preferably two-blade internal-hole saws.
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