Isolation testing scheme for multi-die packages
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United States of America Patent
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-
Jul 29, 2003
Grant Date -
N/A
app pub date -
May 30, 2001
filing date -
May 30, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A test platform is configured to test a mult-die package having at a first die and a second die. The test platform includes a first lead that is connected to the VCC input on the first die. The test platform also includes a second lead that is connected to VCCIO input on the second die. The VCC input on the second die is connected to ground. The I/O pin of the second die can then be tri-stated using a control circuit disposed between the pre-driver and the driver of the I/O buffer.
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