Process for laminating conductive-lubricant coated metals for printed circuit boards

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United States of America Patent

PATENT NO 11963309
APP PUB NO 20230007788A1
SERIAL NO

17305223

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Abstract

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Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.

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Patent Owner(s)

Patent OwnerAddress
MELLANOX TECHNOLOGIES LTDHAKIDMA 26 OFER INDUSTRIAL PARK YOKNEAM 2069200

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Atias, Boaz Maale Adumim, IL 18 21
Ben-Naim, Yosi Eilat, IL 7 18
Danino, Shlomo Netanya, IL 2 8
Eliya, Yaad Magen Shaul, IL 2 8
Levi, Adi Rosh HaAyin, IL 8 17
Lipp, Eran Hefer, IL 3 8
Mentovich, Elad Tel Aviv, IL 202 281
Naveh, Doron Petah-Tikva, IL 14 27
Rotem, Yaniv Nesher, IL 9 20
Rubinstein, Alon Kfar-Yona, IL 5 0
Ruso, Ran Hasson Tel Aviv, IL 5 1

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