Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 12256490
APP PUB NO 20200404783A1
SERIAL NO

16770484

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
RESONAC CORPORATION9-1 HIGASHI-SHIMBASHI 1-CHOME MINATO-KU TOKYO 1057325 JAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyagi, Kouichi Tokyo, JP 9 61
Fujimoto, Daisuke Tokyo, JP 32 213
Kamigata, Yasuo Tokyo, JP 35 255
Kikuchi, Sayaka Tokyo, JP 2 0
Kotake, Tomohiko Tokyo, JP 56 151
Negishi, Harumi Tokyo, JP 5 15
Shimizu, Akira Tokyo, JP 339 17880
Shimizu, Mari Tokyo, JP 13 17
Takanezawa, Shin Tokyo, JP 32 329

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Sep 18, 2028
7.5 Year Payment $3600.00 $1800.00 $900.00 Sep 18, 2032
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 18, 2036
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00