Process and composition for conductive material removal by electrochemical mechanical polishing
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United States of America Patent
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Sep 1, 2009
Grant Date -
Oct 6, 2005
app pub date -
May 5, 2005
filing date -
Mar 14, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
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