Slurry composition, method of polishing an object and method of forming a contact in a semiconductor device using the slurry composition
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United States of America Patent
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Issued Date -
Aug 24, 2006
app pub date -
Dec 29, 2005
filing date -
Dec 30, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
In a slurry composition preventing damage to an insulation layer, and uniformly polishing a metal layer, the slurry composition includes an acidic aqueous solution having a first pH and an anionic surfactant having a second pH lower than or equal to the first pH. Irregular polishing of the metal layer relative to a pattern density may be prevented and a contact having a uniform thickness may be formed using the slurry composition.
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