METHOD FOR CONTROLLING POLISHING FLUID DISTRIBUTION

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United States of America Patent

SERIAL NO

11456674

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, a method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher includes flowing polishing fluid to a first portion of the polishing surface through a first outlet while a second portion of the polishing surface adjacent a second outlet receives no flow of polishing fluid, and flowing polishing fluid through the second outlet to the second portion of the polishing surface.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Downum, Brian J Vancouver, WA 2 15
Hachnochi, Daniel Palo Alto, CA 5 89
Hearne, John Los Altos, CA 5 130
Ko, Terry Kin-Ting South San Francisco, CA 5 52
Lee, Christopher Heung-Gyun Alameda, CA 19 79
Reynolds, Kenneth Reese Los Gatos, CA 5 55
Skarpelos, Peter N Berkeley, CA 2 15
Vereen, Lidia Pleasanton, CA 10 111
Williams, Patrick Tracy, CA 83 838

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