Containment of a wafer-chuck thermal interface fluid
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 23, 2011
Grant Date -
Nov 1, 2007
app pub date -
Apr 28, 2006
filing date -
Apr 28, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method includes circulating a heat transferring fluid in a substantially closed system including an interstice between a wafer and a chuck at a first pressure. The method further includes pumping the fluid out of the interstice and increasing the pressure of the fluid to a second pressure. The method further includes reducing the pressure of the fluid to the first pressure and returning the fluid to the interstice. In the system, the fluid in the interstice transfers heat from the wafer to the chuck, or vice versa, by conduction. The presence of a conducting fluid in the interstice thereby decreases the resistivity of the interface, and enables more efficient heat transfer from the wafer to the chuck.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully