Abrasive liquid for metal and method for polishing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8491807
APP PUB NO 20120048830A1
SERIAL NO

13218590

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Importance

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Abstract

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An abrasive liquid for a metal comprising (1) an oxidizing agent for a metal, (2) a dissolving agent for an oxidized metal, (3) a first protecting film-forming agent such as an amino acid or an azole which adsorbs physically on the surface of the metal and/or forms a chemical bond, to thereby form a protecting film, (4) a second protecting film-forming agent such as polyacrylic acid, polyamido acid or a salt thereof which assists the first protecting film-forming agent in forming a protecting film and (5) water; and a method for polishing.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI CHEMICAL COMPANY, LTD.TOKYO785
RENESAS ELECTRONICS CORPORATIONTOKYO11993

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Honma, Yoshio Kokubunji, JP 14 136
Hoshino, Tetsuya Tsukuba, JP 24 155
Kamigata, Yasuo Tsukuba, JP 33 197
Kondoh, Seiichi Kokubunji, JP 8 57
Matsuzawa, Jun Hitachi, JP 23 236
Terazaki, Hiroki Tsukuba, JP 24 217
Uchida, Takeshi Tsukuba, JP 87 448

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
5084071 Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor 163 1990
 
Minnesota Mining and Manufacturing Company (1)
5958794 Method of modifying an exposed surface of a semiconductor wafer 302 1996
 
3M INNOVATIVE PROPERTIES COMPANY (1)
6194317 Method of planarizing the upper surface of a semiconductor wafer 142 1998
 
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AKTIENGESELLSCHAFT (1)
4968381 Method of haze-free polishing for semiconductor wafers 47 1988
 
CABOT MICROELECTRONICS CORPORATION (3)
4954142 Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor 218 1989
5954997 Chemical mechanical polishing slurry useful for copper substrates 280 1996
6316366 Method of polishing using multi-oxidizer slurry 18 2000
 
MICRON TECHNOLOGY, INC. (2)
6206756 Tungsten chemical-mechanical polishing process using a fixed abrasive polishing pad and a tungsten layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad 148 1998
6276996 Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad 160 1998
 
HITACHI, LTD. (1)
6561883 Method of polishing 19 2000
 
PENNZOIL-QUAKER STATE COMPANY (1)
6013323 Silicone gel waxes and silicone gel protectants 30 1998
 
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. (4)
5860848 Polishing silicon wafers with improved polishing slurries 52 1996
5770103 Composition and method for polishing a composite comprising titanium 40 1997
5932486 Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers 56 1997
6607424 Compositions for insulator and metal CMP and methods relating thereto 16 2000
 
TRW INC. (1)
4537654 Two-gate non-coplanar FET with self-aligned source 24 1983
 
FUJIMI INCORPORATED (2)
4956015 Polishing composition 56 1989
5733819 Polishing composition 61 1997
 
RENESAS ELECTRONICS CORPORATION (1)
6326299 Method for manufacturing a semiconductor device 37 1999
 
TEXAS INSTRUMENTS INCORPORATED (1)
5434107 Method for planarization 86 1994
 
KABUSHIKI KAISHA TOSHIBA (5)
5607718 Polishing method and polishing apparatus 76 1994
5575885 Copper-based metal polishing solution and method for manufacturing semiconductor device 112 1994
5770095 Polishing agent and polishing method using the same 205 1995
5691219 Method of manufacturing a semiconductor memory device 42 1995
5981394 Chemical mechanical polishing method, polisher used in chemical mechanical polishing and method of manufacturing semiconductor device 14 1997
 
LG DISPLAY CO., LTD. (1)
5835176 Method for planarizing a substrate of a liquid crystal display 25 1998
 
VERSUM MATERIALS US, LLC (3)
5876490 Polish process and slurry for planarization 111 1997
6117783 Chemical mechanical polishing composition and process 141 1998
6313039 Chemical mechanical polishing composition and process 54 2000
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
HITACHI CHEMICAL COMPANY, LTD. (5)
8845915 Abrading agent and abrading method 0 2010
* 8889555 Polishing agent for copper polishing and polishing method using same 0 2010
* 2012/0024,818 POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME 4 2010
* 8859429 Polishing agent for copper polishing and polishing method using same 0 2012
* 2012/0160,804 POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME 4 2012
* Cited By Examiner

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