Adjusting sizes of connectors of package components

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8791579
APP PUB NO 20130127059A1
SERIAL NO

13299100

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Abstract

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A device includes a plurality of connectors on a top surface of a package component. The plurality of connectors includes a first connector having a first lateral dimension, and a second connector having a second lateral dimension. The second lateral dimension is greater than the first lateral dimension. The first and the second lateral dimensions are measured in directions parallel to a major surface of the package component.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD8 LI-HSIN RD 6 HSINCHU SCIENCE PARK HSINCHU 300-78

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chia-Tung Junan, TW 5 130
Ho, Ming-Che Tainan, TW 132 1332
Kuo, Hung-Jui Hsin-Chu, TW 427 1983
Lai, Chih-Wei Hsin-Chu, TW 39 205
Liu, Chung-Shi Hsin-Chu, TW 824 11367
Wang, Chien Rhone Hsin-Chu, TW 18 72
Yang, Tzong-Hann Taipei, TW 8 21

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