Method of manufacturing a MEMS device

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United States of America Patent

PATENT NO 8763220
APP PUB NO 20130147317A1
SERIAL NO

13765556

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Abstract

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Provided is a manufacturing method for a micro device. The manufacturing method includes forming a micro-electronic-mechanical system (MEMS) movable structure, forming a plurality of metal loops over the MEMS movable structure, forming a piezoelectric element over the MEMS movable structure, and a magnet disposed over the plurality of metal loops. The method also includes encapsulating the MEMS movable structure, the plurality of metal loops, and the piezoelectric element.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD ("TSMC")NO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chu, Chia-Hua Zhubei, TW 192 2736
Chung, Tien-Kan Pingzhen, TW 8 27
Huang, Yao-Te Hsinchu, TW 55 445
Hung, Chia-Ming Taipei, TW 44 376
Lin, Chung-Hsien Hsinchu, TW 82 1467
Tai, Wen-Chuan Dayuan Township, Taoyuan County, TW 56 382
Yang, Chang-Yi Hsinchu, TW 12 42

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