CIRCUIT MODULE AND METHOD OF PRODUCING THE SAME
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United States of America Patent
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N/A
Issued Date -
Feb 12, 2015
app pub date -
Dec 10, 2013
filing date -
Aug 12, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit module includes a wiring substrate having a mount surface and a conductor pattern, the mount surface having first and second areas, the conductor pattern being formed along a boundary between the first and second areas on the mount surface, an outermost layer of the conductor pattern including Au or Ag; a plurality of electronic components mounted on the first and second areas; an insulating sealing layer formed along the boundary, the insulating sealing layer having a trench with a depth such that at least a part of the outermost layer of the conductor pattern is exposed, the insulating sealing layer covering the electronic components; and a conductive shield having first and second shield portions, the first shield portion covering an outer surface of the sealing layer, the second shield portion being formed at the trench, the second shield portion being electrically connected to the conductor pattern.
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