DIE AND METHOD OF PRODUCING DIE

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United States of America Patent

SERIAL NO

14601405

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Abstract

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Provided are a low-cost and highly-precise structure-molding die that only requires a short production time, and a method of producing the die. The die is characterized by including: a plate-like first member 10 that serves as a base; a second member 2 that has cells 2 of a shape matching a to-be-molded structure and is joined to the first member 10; molding grooves 7 that have a predetermined depth and are disposed between the cells 2; and a supply hole 6 that communicates with the first member 10 at a predetermined intersection of the molding grooves 7 from an opposite side from the cells 2 joined.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
HODEN SEIMITSU KAKO KENKYUSHO CO LTDATSUGI-SHI KANAGAWA 243-0213

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAKAGAWA, Dai Kasugai-shi, JP 37 52

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