SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Sep 17, 2015
app pub date -
Aug 29, 2014
filing date -
Mar 17, 2014
priority date (Note) -
Abandoned
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Abstract
According to one embodiment, a semiconductor device includes a first electrode on a surface of a semiconductor layer and a plurality of second electrodes on the first electrode. Each second electrode has a shape in a plane that is parallel to the surface of the semiconductor layer having dimensions of 50 micrometers or less. A resin layer is between the plurality of second electrodes, and has a modulus that is lower than a modulus of the second electrodes.
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