Surface-mount connector structure for embedded optical and electrical traces
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United States of America Patent
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Feb 9, 2016
Grant Date -
Jan 14, 2016
app pub date -
Aug 15, 2014
filing date -
Jul 10, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A system for use with optical and electrical signaling is disclosed. The system may include a printed circuit board (PCB) that includes a plurality of layers vertically stacked between a first face and a second face and a first optical signal transmission path within a first internal layer of the plurality of layers. The PCB may also include an electrical signal transmission path and a via extending through the plurality of layers. The via may include a first reflective surface that is configured to reflect light between the first optical signal transmission path and an opening of the via on the first face and an electrically conductive material that is configured to electrically connect the electrical signal transmission path to a portion of the via on the first face.
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