NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY COATING
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United States of America Patent
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Issued Date -
Apr 21, 2016
app pub date -
Oct 21, 2015
filing date -
Oct 21, 2014
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed herein are edge-coated microelectronic packages comprising a microelectronic package having a top, a bottom, and an exposed edge, and a coating comprising a polymer, wherein the microelectronic package comprises a glass substrate, and wherein the coating covers at least a portion of the top, at least a portion of the bottom, and at least a portion of the exposed edge of the microelectronic package. Also disclosed herein are methods of making and using edge-coated microelectronic packages.
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