Multi-cycle wafer cleaning method

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United States of America Patent

PATENT NO 9687885
APP PUB NO 20170014871A1
SERIAL NO

14802203

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods for cleaning a wafer in semiconductor fabrication are provided. The method includes providing a wafer. The method further includes cleaning the wafer in a first cleaning cycle by supplying a cleaning solution and supplying a first washing liquid mixed with a purge gas in sequence. The method also includes cleaning the wafer in a second cleaning cycle by supplying the cleaning solution and a second washing liquid mixed with the purge gas in sequence. The second cleaning cycle is initiated after the first cleaning cycle is finished.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cai, Ying-Jie Hsinchu, TW 1 1
Chou, Bo-Wei Hsinchu, TW 8 19
Kao, Shih-Hsing Hsinchu, TW 1 1
Lee, Tzu-Min New Taipei, TW 2 10
Lien, Wen-Cheng Hsinchu County, TW 10 24
Yang, Shin-Hsien Tainan, TW 1 1
Yu, Tai-Yung Tainan, TW 9 24

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