COMPOSITE WIRING BOARD AND METHOD FOR MANUFACTURING COMPOSITE WIRING BOARD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170374742A1
SERIAL NO

15629777

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A composite wiring board includes a first wiring board including a first insulating layer, a first conductor layer formed on the first insulating layer, and metal elements penetrating the first insulating layer and the first conductor layer such that the metal elements are electrically connected to each other by the first conductor layer, and a second wiring board including a second insulating layer and a second conductor layer forming on the second insulating layer and including metal connection terminals such that the metal connection terminals are corresponding to and directly bonded to the metal elements of the first wiring board, respectively.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
IBIDEN CO LTD1 KANDACHO 2-CHOME OGAKI GIFU 503-8604

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FURUNO, Takayuki Ogaki-shi, JP 23 147
HIRASAWA, Takahisa Ogaki-shi, JP 25 42
TSUKADA, Kiyotaka Ibi-gun, JP 52 1119

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation