SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
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United States of America
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Issued Date -
Apr 10, 2025
app pub date -
Oct 10, 2024
filing date -
Oct 10, 2024
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Abstract
Systems, methods, and apparatus are described herein for maintaining high signal integrity and high bandwidth in data transmissions between an integrated circuit package and a PCB. The integrated circuit package has multiple layers. Signal pins for connecting the integrated circuit package, both physically and electrically, to the PCB are located at a first layer. A signal trace is coupled to each signal pin. The signal trace bifurcates into two branches and couples to a given signal pin at the distal end of each branch.
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