Endothermic cooler for electronic components
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United States of America Patent
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-
Feb 9, 1993
Grant Date -
N/A
app pub date -
Nov 18, 1991
filing date -
Nov 18, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An endothermic cooler (10) for electronic components (16) in, for example, a missile (12) includes an enclosure (14) having a thermally conductive coupling to the electronic component. A source of water in a first compartment (28) is segregated from salts in a second compartment (30). The salts are capable of providing an endothermic reaction when mixed in a water solution. The two compartments are segregated from one another by a membrane or conduit (32). The membrane is pierced by a spike (34-2 or 34-3) through an actuating mechanism (36) and the conduit is opened by a valve (34-4). Formation of the solution provides cooling for conduction of heat from the electronic component through a thermally conductive plate (24) and its fins (26).
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