Apparatus for full wafer deposition
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United States of America Patent
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Dec 31, 1996
Issued Date -
N/A
app pub date -
Sep 22, 1994
filing date -
Sep 30, 1992
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a shield arrangement that prevents deposition in the area of the chamber surrounding the substrate. This shield arrangement is equipped with a wall-like member which surrounds a substrate, and includes a projecting annular flange and a substrate support which extends in the horizontal direction beyond the substrate, and includes a groove therein. The annular flange is received in the groove to shield the deposition region of the chamber from the remainder of the chamber.
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