Chemically removable Cu CMP slurry abrasive
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United States of America Patent
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Jan 2, 2001
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N/A
app pub date -
Nov 25, 1998
filing date -
Nov 25, 1998
priority date (Note) -
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Abstract
Abrasion of Cu metallization during CMP is reduced and residual slurry particulate removal facilitated by employing a CMP slurry containing a dispersion of soft mineral particles having high solubility in dilute acids. Embodiments include CMP Cu metallization with a slurry containing magnesium oxide particles and removing any residual magnesium oxide particles after CMP with an organic acid, such as citric acid or acetic acid, or a dilute inorganic acid, such as hydrochloric, phosphoric, boric or fluoboric acid.
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