Electrostatic chuck bonded to base with a bond layer and method
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United States of America Patent
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-
Dec 3, 2002
Grant Date -
Jun 20, 2002
app pub date -
Aug 13, 2001
filing date -
May 7, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about .+-.30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.
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