Semiconductor device having a plurality of stacked wiring boards

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6528870
APP PUB NO 20010028104A1
SERIAL NO

09769394

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Abstract

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In a stacked-type semiconductor unit having a plurality of semiconductor devices stacked on a base board including a base electrode, each semiconductor device has a wiring board including an external electrode provided in an end portion thereof. The semiconductor devices are stacked on the base board such that the external electrodes are aligned with one another. Then, the external electrodes are electrically connected to the base board by solder.

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Patent Owner(s)

  • KABUSHIKI KAISHA TOSHIBA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arakawa, Masayuki Yokohama, JP 42 549
Fukatsu, Kenta Fujisawa, JP 13 113
Fukuchi, Yoshitoshi Yokohama, JP 1 92
Iguchi, Tomohiro Yokohama, JP 47 385
Komatsu, Tetsuro Yokohama, JP 38 1068
Saito, Yasuhito Yokohama, JP 25 502
Watanabe, Naotake Yokohama, JP 19 178

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