Electronics assembly apparatus with height sensing sensor
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United States of America Patent
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Aug 19, 2003
Grant Date -
N/A
app pub date -
Nov 4, 1999
filing date -
Nov 5, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pick and place machine, and its imaging system are disclosed. The imaging system is movable with a head of the pick and place machine and includes a linear detector which is adapted to move proximate the component to thereby scan the component. The imaging system provides an indication of feature height on a component held by the pick and place machine. The height is based upon the intensity of a plurality of focused images. A method for sensing feature height of an object on a component as well as the coplanarity of objects held by a pick and place machine is also provided.
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