Printed circuits on shrink film
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United States of America Patent
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Apr 25, 2006
Issued Date -
N/A
app pub date -
Dec 18, 2003
filing date -
Dec 18, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Methods of creating fine featured circuits by printing a circuit trace onto polymer shrink films or other biaxially-oriented polymer films are disclosed. The shrink films are heated and shrunk after printing, annealing the circuit trace to form conductive features. Compositions suitable for printing onto the films and articles made using the method and composition are also disclosed.
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