Alpha tantalum capacitor plate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 28, 2011
Grant Date -
May 7, 2009
app pub date -
Nov 1, 2007
filing date -
Nov 1, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for forming an alpha-tantalum layer comprising disposing a nitrogen containing base layer on a semiconductor substrate, bombarding the nitrogen containing base layer with a bombarding element, thereby forming an alpha-tantalum seed layer, and sputtering a layer of tantalum on the alpha-tantalum seed layer, thereby forming a surface layer of substantially alpha-tantalum.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully